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FR4 ROGERS Aluminum High TG CEM3 PCB Assembly For Medical Industry

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Guangzhou Highleap Electronic Co.,Ltd.

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Name: FR4 ROGERS Aluminum High TG CEM3 PCB Assembly For Medical Industry
Brand: HighLeap
Price: 1 USD

Brand Name : HighLeap

Model Number : PCBA

Certification : ISO9001/Iso14001/CE/ROHS

Place of Origin : China

MOQ : 1pcs

Price : USD 1-30 piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 piece per week

Delivery Time : 1-15 working days

Packaging Details : Vacuum Package

Product name : medical pcb assembly

Copper Thickness : 0.5oz-12oz

Surface Finishing : HASL\OSP\immersion Gold\ENIG

Base Material : FR4/ROGERS/Aluminum/High TG/CEM-3

Board Thickness : 0.2mm-2.0mm

Testing Service : 100% Testing AOI supported

Layer : 1-64 Layers

Usage : Medical Equipment

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FR4/ROGERS/Aluminum/High TG/CEM-3 pcb assembly for the medical industry

PCB Techinecal Capacity

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

PCBA technical Capacity

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
Press-fit	Air bladder rate:less than 20%
	Press range:0-50KN
	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling

About HighLeap Electronic

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For PCB board, you need to prepare files of Gerber file,it should including RS-274X,ODB++, DXF, PCB, PCBDOC etc formats.
For PCBA(PCB with soldered components), except the file for PCB, you also need to prepare the BOM list (components list), Pick and Place file(txt format), real sample pictureor 3D PDF version file etc.

Q. Do you have any MOQ Limited ?
We havent any limited about MOQ .Sample and mass production all can support.

Product Tags:

High TG CEM3 PCB Assembly

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